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  1. product pro?le 1.1 general description dual isolated general-purpose zener diodes in sot353 (sc-88a) very small surface-mounted device (smd) standard plastic and dark-green plastic packages. 1.2 features 1.3 applications n general regulation functions 1.4 quick reference data [1] pulse test: t p 300 m s; d 0.02. [2] t p = 100 m s; square wave; t j =25 c prior to surge pzuxdb2 series dual zener diodes rev. 01 31 march 2008 product data sheet n non-repetitive peak reverse power dissipation: p zsm =40w n dual isolated diodes con?guration n total power dissipation: p tot 250 mw n small standard plastic package suitable for surface-mounted design n tolerance series: b2: approximately 2% n small dark-green, halogen-free plastic package suitable for surface-mounted design n wide working voltage range: nominal 2.7 v to 24 v n aec-q101 quali?ed table 1. quick reference data symbol parameter conditions min typ max unit per diode v f forward voltage i f = 100 ma [1] - - 1.1 v p zsm non-repetitive peak reverse power dissipation [2] --40w
pzuxdb2_ser_1 ? nxp b.v. 2008. all rights reserved. product data sheet rev. 01 31 march 2008 2 of 12 nxp semiconductors pzuxdb2 series dual zener diodes 2. pinning information 3. ordering information [1] the series consists of 25 types with nominal working voltages from 2.7 v to 24 v. [2] /dg: halogen-free plastic package 4. marking table 2. pinning pin description simpli?ed outline graphic symbol 1 anode (diode 1) 2 not connected 3 anode (diode 2) 4 cathode (diode 2) 5 cathode (diode 1) 13 2 4 5 006aab219 13 54 2 table 3. ordering information type number package name description version pzu2.7db2 to pzu24db2 [1] sc-88a plastic surface-mounted package; 5 leads sot353 pzu2.7db2/dg to pzu24db2/dg [1] [2] table 4. marking codes type number marking code [1] type number [2] marking code [1] pzu2.7db2 t1* pzu2.7db2/dg u1* pzu3.0db2 t2* pzu3.0db2/dg u2* pzu3.3db2 t3* pzu3.3db2/dg u3* pzu3.6db2 t4* pzu3.6db2/dg u4* pzu3.9db2 t5* pzu3.9db2/dg u5* pzu4.3db2 t6* pzu4.3db2/dg u6* pzu4.7db2 t7* pzu4.7db2/dg u7* pzu5.1db2 t8* pzu5.1db2/dg u8* pzu5.6db2 t9* pzu5.6db2/dg u9* pzu6.2db2 ta* pzu6.2db2/dg ua* pzu6.8db2 tb* pzu6.8db2/dg ub* pzu7.5db2 tc* pzu7.5db2/dg uc* pzu8.2db2 td* pzu8.2db2/dg ud* pzu9.1db2 te* pzu9.1db2/dg ue*
pzuxdb2_ser_1 ? nxp b.v. 2008. all rights reserved. product data sheet rev. 01 31 march 2008 3 of 12 nxp semiconductors pzuxdb2 series dual zener diodes [1] * = -: made in hong kong * = p: made in hong kong * = t: made in malaysia * = w: made in china [2] /dg: halogen-free plastic package 5. limiting values [1] t p = 100 m s; square wave; t j =25 c prior to surge [2] device mounted on an fr4 printed-circuit board (pcb), single-sided copper, tin-plated and standard footprint. [3] device mounted on an fr4 pcb, single-sided copper, tin-plated, mounting pad for cathode 1 cm 2 . pzu10db2 tf* pzu10db2/dg uf* pzu11db2 tg* pzu11db2/dg ug* pzu12db2 th* pzu12db2/dg uh* pzu13db2 tk* pzu13db2/dg uk* pzu14db2 tl* pzu14db2/dg ul* pzu15db2 tm* pzu15db2/dg um* pzu16db2 tn* pzu16db2/dg un* pzu18db2 tp* pzu18db2/dg up* pzu20db2 tr* pzu20db2/dg ur* pzu22db2 ts* pzu22db2/dg us* pzu24db2 tt* pzu24db2/dg ut* table 4. marking codes continued type number marking code [1] type number [2] marking code [1] table 5. limiting values in accordance with the absolute maximum rating system (iec 60134). symbol parameter conditions min max unit per diode i f forward current - 200 ma i zsm non-repetitive peak reverse current [1] - see t ab le 8 p zsm non-repetitive peak reverse power dissipation [1] -40w per device p tot total power dissipation t amb 25 c [2] - 250 mw [3] - 275 mw t j junction temperature - 150 c t amb ambient temperature - 55 +150 c t stg storage temperature - 65 +150 c
pzuxdb2_ser_1 ? nxp b.v. 2008. all rights reserved. product data sheet rev. 01 31 march 2008 4 of 12 nxp semiconductors pzuxdb2 series dual zener diodes 6. thermal characteristics [1] device mounted on an fr4 pcb, single-sided copper, tin-plated and standard footprint. [2] device mounted on an fr4 pcb, single-sided copper, tin-plated, mounting pad for cathode 1 cm 2 . [3] soldering points at pin 4 and pin 5. 7. characteristics [1] pulse test: t p 300 m s; d 0.02. table 6. thermal characteristics symbol parameter conditions min typ max unit per device r th(j-a) thermal resistance from junction to ambient in free air [1] - - 500 k/w [2] - - 455 k/w r th(j-sp) thermal resistance from junction to solder point [3] - - 200 k/w table 7. characteristics t j =25 c unless otherwise speci?ed. symbol parameter conditions min typ max unit per diode v f forward voltage [1] i f = 10 ma - - 0.9 v i f = 100 ma - - 1.1 v table 8. characteristics per type; pzu2.7db2 to pzu24db2 and pzu2.7db2/dg to pzu24db2/dg t j =25 c unless otherwise speci?ed. pzuxdb2 pzuxdb2/dg working voltage v z (v) differential resistance r dif ( w ) reverse current i r ( m a) temperature coef?cient s z (mv/k) diode capacitance c d (pf) [1] non-repetitive peak reverse current i zsm (a) [2] i z =5ma i z = 0.5 ma i z =5ma i z =5ma min max max max max v r (v) typ max max 2.7 2.65 2.9 1000 100 20 1 - 2.0 440 8 3.0 2.95 3.2 1000 95 10 1 - 2.1 425 8 3.3 3.25 3.5 1000 95 5 1 - 2.4 410 8 3.6 3.55 3.8 1000 90 5 1 - 2.4 390 8 3.9 3.87 4.1 1000 90 3 1 - 2.5 370 8 4.3 4.15 4.34 1000 90 3 1 - 2.5 350 8 4.7 4.55 4.75 800 80 2 1 - 1.4 325 8 5.1 4.98 5.2 250 60 2 1.5 0.3 300 5.5 5.6 5.49 5.73 100 40 1 2.5 1.9 275 5.5 6.2 6.06 6.33 80 30 0.5 3 2.7 250 5.5 6.8 6.65 6.93 60 20 0.5 3.5 3.4 215 5.5 7.5 7.28 7.6 60 10 0.5 4 4.0 170 3.5
pzuxdb2_ser_1 ? nxp b.v. 2008. all rights reserved. product data sheet rev. 01 31 march 2008 5 of 12 nxp semiconductors pzuxdb2 series dual zener diodes [1] f = 1 mhz; v r =0v [2] t p = 100 m s; square wave; t j =25 c prior to surge 8.2 8.02 8.36 60 10 0.5 5 4.6 150 3.5 9.1 8.85 9.23 60 10 0.5 6 5.5 120 3.5 10 9.77 10.21 60 10 0.1 7 6.4 110 3.5 11 10.76 11.22 60 10 0.1 8 7.4 108 3 12 11.74 12.24 80 10 0.1 9 8.4 105 3 13 12.91 13.49 80 10 0.1 10 9.4 103 2.5 14 13.7 14.3 80 10 0.1 11 10.4 101 2 15 14.34 14.98 80 15 0.05 11 11.4 99 2 16 15.85 16.51 80 20 0.05 12 12.4 97 1.5 18 17.56 18.35 80 20 0.05 13 14.4 93 1.5 20 19.52 20.39 100 20 0.05 15 16.4 88 1.5 22 21.54 22.47 100 25 0.05 17 18.4 84 1.3 24 23.72 24.78 120 30 0.05 19 20.4 80 1.3 table 8. characteristics per type; pzu2.7db2 to pzu24db2 and pzu2.7db2/dg to pzu24db2/dg continued t j =25 c unless otherwise speci?ed. pzuxdb2 pzuxdb2/dg working voltage v z (v) differential resistance r dif ( w ) reverse current i r ( m a) temperature coef?cient s z (mv/k) diode capacitance c d (pf) [1] non-repetitive peak reverse current i zsm (a) [2] i z =5ma i z = 0.5 ma i z =5ma i z =5ma min max max max max v r (v) typ max max
pzuxdb2_ser_1 ? nxp b.v. 2008. all rights reserved. product data sheet rev. 01 31 march 2008 6 of 12 nxp semiconductors pzuxdb2 series dual zener diodes t j =25 c (prior to surge) t j =25 c fig 1. non-repetitive peak reverse power dissipation as a function of pulse duration; maximum values fig 2. forward current as a function of forward voltage; typical values t j =25 c to 150 c pzu2.7db2 to pzu4.3db2 pzu2.7db2/dg to pzu4.3db2/dg t j =25 c to 150 c pzu4.7db2 to pzu12db2 pzu4.7db2/dg to pzu12db2/dg fig 3. temperature coef?cient as a function of working current; typical values fig 4. temperature coef?cient as a function of working current; typical values 006aab215 10 2 10 10 3 p zsm (w) 1 t p (s) 10 - 4 10 - 2 10 - 3 v f (v) 0.6 1 0.8 mbg781 100 200 300 i f (ma) 0 060 0 - 2 - 3 - 1 20 40 i z (ma) s z (mv/k) 4.3 3.9 3.6 3.3 3.0 2.7 006aab216 020 16 10 0 - 5 5 mgl274 4812 i z (ma) s z (mv/k) 4.7 12 11 10 9.1 8.2 7.5 6.8 6.2 5.6 5.1
pzuxdb2_ser_1 ? nxp b.v. 2008. all rights reserved. product data sheet rev. 01 31 march 2008 7 of 12 nxp semiconductors pzuxdb2 series dual zener diodes 8. test information 8.1 quality information this product has been quali?ed in accordance with the automotive electronics council (aec) standard q101 - stress test quali?cation for discrete semiconductors , and is suitable for use in automotive applications. t j =25 c pzu2.7db2 to pzu6.2db2 pzu2.7db2/dg to pzu6.2db2/dg t j =25 c pzu6.8db2 to pzu24db2 pzu6.8db2/dg to pzu24db2/dg fig 5. working current as a function of working voltage; typical values fig 6. working current as a function of working voltage; typical values 006aab217 10 - 1 10 - 2 10 1 10 2 i z (ma) 10 - 3 v z (v) 07 56 4 3 12 v z(nom) (v) = 2.7 5.1 5.6 6.2 3.0 3.3 3.6 3.9 4.3 4.7 006aab218 10 - 1 10 - 2 10 1 10 2 i z (ma) 10 - 3 v z (v) 025 20 10 15 5 7.5 16 18 20 22 24 8.2 9.1 10 11 12 13 14 15 v z(nom) (v) = 6.8
pzuxdb2_ser_1 ? nxp b.v. 2008. all rights reserved. product data sheet rev. 01 31 march 2008 8 of 12 nxp semiconductors pzuxdb2 series dual zener diodes 9. package outline 10. packing information [1] for further information and the availability of packing methods, see section 13 . fig 7. package outline sot353 (sc-88a) 04-11-16 dimensions in mm 0.25 0.10 0.3 0.2 1.3 0.65 2.2 2.0 1.35 1.15 2.2 1.8 1.1 0.8 0.45 0.15 13 2 4 5 table 9. packing methods the indicated -xxx are the last three digits of the 12nc ordering code. [1] type number package description packing quantity 3000 10000 pzu2.7db2 to pzu24db2 sot353 4 mm pitch, 8 mm tape and reel -115 -135 pzu2.7db2/dg to pzu24db2/dg
pzuxdb2_ser_1 ? nxp b.v. 2008. all rights reserved. product data sheet rev. 01 31 march 2008 9 of 12 nxp semiconductors pzuxdb2 series dual zener diodes 11. soldering fig 8. re?ow soldering footprint sot353 (sc-88a) dimensions in mm fig 9. wave soldering footprint sot353 (sc-88a) sot353_fr solder resist occupied area solder lands solder paste dimensions in mm 0.60 (1 ) 0.50 (4 ) 0.50 (4 ) 2.65 0.40 0.90 1.20 2.40 2.10 2.35 solder lands solder resist occupied area 1.15 3.75 transport direction during soldering 1.00 0.30 4.00 0.70 4.50 2.65 2.25 2.70
pzuxdb2_ser_1 ? nxp b.v. 2008. all rights reserved. product data sheet rev. 01 31 march 2008 10 of 12 nxp semiconductors pzuxdb2 series dual zener diodes 12. revision history table 10. revision history document id release date data sheet status change notice supersedes pzuxdb2_ser_1 20080331 product data sheet - -
pzuxdb2_ser_1 ? nxp b.v. 2008. all rights reserved. product data sheet rev. 01 31 march 2008 11 of 12 nxp semiconductors pzuxdb2 series dual zener diodes 13. legal information 13.1 data sheet status [1] please consult the most recently issued document before initiating or completing a design. [2] the term short data sheet is explained in section de?nitions. [3] the product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple dev ices. the latest product status information is available on the internet at url http://www .nxp .com . 13.2 de?nitions draft the document is a draft version only. the content is still under internal review and subject to formal approval, which may result in modi?cations or additions. nxp semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. short data sheet a short data sheet is an extract from a full data sheet with the same product type number(s) and title. a short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. for detailed and full information see the relevant full data sheet, which is available on request via the local nxp semiconductors sales of?ce. in case of any inconsistency or con?ict with the short data sheet, the full data sheet shall prevail. 13.3 disclaimers general information in this document is believed to be accurate and reliable. however, nxp semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. right to make changes nxp semiconductors reserves the right to make changes to information published in this document, including without limitation speci?cations and product descriptions, at any time and without notice. this document supersedes and replaces all information supplied prior to the publication hereof. suitability for use nxp semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of an nxp semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. nxp semiconductors accepts no liability for inclusion and/or use of nxp semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customers own risk. applications applications that are described herein for any of these products are for illustrative purposes only. nxp semiconductors makes no representation or warranty that such applications will be suitable for the speci?ed use without further testing or modi?cation. limiting values stress above one or more limiting values (as de?ned in the absolute maximum ratings system of iec 60134) may cause permanent damage to the device. limiting values are stress ratings only and operation of the device at these or any other conditions above those given in the characteristics sections of this document is not implied. exposure to limiting values for extended periods may affect device reliability. terms and conditions of sale nxp semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www .nxp .com/pro? le/ter ms , including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by nxp semiconductors. in case of any inconsistency or con?ict between information in this document and such terms and conditions, the latter will prevail. no offer to sell or license nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. quick reference data the quick reference data is an extract of the product data given in the limiting values and characteristics sections of this document, and as such is not complete, exhaustive or legally binding. 13.4 trademarks notice: all referenced brands, product names, service names and trademarks are the property of their respective owners. 14. contact information for more information, please visit: http://www .nxp.com for sales of?ce addresses, please send an email to: salesad dresses@nxp.com document status [1] [2] product status [3] de?nition objective [short] data sheet development this document contains data from the objective speci?cation for product development. preliminary [short] data sheet quali?cation this document contains data from the preliminary speci?cation. product [short] data sheet production this document contains the product speci?cation.
nxp semiconductors pzuxdb2 series dual zener diodes ? nxp b.v. 2008. all rights reserved. for more information, please visit: http://www.nxp.com for sales office addresses, please send an email to: salesaddresses@nxp.com date of release: 31 march 2008 document identifier: pzuxdb2_ser_1 please be aware that important notices concerning this document and the product(s) described herein, have been included in section legal information. 15. contents 1 product pro?le . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.1 general description. . . . . . . . . . . . . . . . . . . . . . 1 1.2 features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.3 applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.4 quick reference data. . . . . . . . . . . . . . . . . . . . . 1 2 pinning information . . . . . . . . . . . . . . . . . . . . . . 2 3 ordering information . . . . . . . . . . . . . . . . . . . . . 2 4 marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 5 limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3 6 thermal characteristics. . . . . . . . . . . . . . . . . . . 4 7 characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 4 8 test information . . . . . . . . . . . . . . . . . . . . . . . . . 7 8.1 quality information . . . . . . . . . . . . . . . . . . . . . . 7 9 package outline . . . . . . . . . . . . . . . . . . . . . . . . . 8 10 packing information. . . . . . . . . . . . . . . . . . . . . . 8 11 soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 12 revision history . . . . . . . . . . . . . . . . . . . . . . . . 10 13 legal information. . . . . . . . . . . . . . . . . . . . . . . 11 13.1 data sheet status . . . . . . . . . . . . . . . . . . . . . . 11 13.2 de?nitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 13.3 disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 13.4 trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 14 contact information. . . . . . . . . . . . . . . . . . . . . 11 15 contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12


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